Innovation based on experience

The Heyday team has leveraged many years of experience to develop a unique technology enabling high performance gate drivers.  In one single package and across one single internal isolation boundary both the gate drive signal and the drive power are transferred.  

We have called it power-thru^®.

A single 2.6mm high LGA package now delivers isolated gate drive and energy at high speeds to your GaN and MOS FETs.  This enables improvements in efficiency, BOM count, module size, reliability and cost. Great news for all power module designers!

Quality & Reliability guaranteed

Innovation + proven materials and processes

                   =

high performance + high reliability

The Heyday technology is using reliable CMOS silicon technology whose reliability has been proven for decades in all possible applications and situations.

The core innovations reside at the circuit logic level. No reliability issues here neither.

And to increase quality and reliability even more, we provide a  single component solution ... making life simpler as well.